Physical Analyses
Analyses and Reliability Evaluations of Electronic Materials/Mounted Components in Semiconductors
JFE-TEC undertakes analysis and reliability evaluation of joining (solder, wire bonding, die bonding, and interlayer joining), short circuit/wire breakage, exfoliation, corrosion, migration, etc. of power device, IC and other mounted components of electronic part.
Analysis of Joining, Short Circuit/Wire Breakage, Exfoliation, Corrosion, and Migration of Mounted Components
JFE-TEC undertakes analysis of joining (solder, wire bonding, die bonding, and interlayer joining), short circuit/wire breakage, exfoliation, corrosion, migration, etc. of power device, IC and other mounted components of electronic part.
Reliability Test/ Failure Investigation of Electronic Parts/Devices
JFE-TEC undertakes cause analyses of problems and failures in LSI products, single electronic components, mounted substrates and electronic components, and evaluate their reliability. We quickly and accurately conduct evaluation of reliability of solder joining portions associated with disuse of lead.
