Physical Analyses

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Analyses of Thin Film and Surface Treatment

Functionalities of thin film materials and surface treatment materials (friction, sliding, press property, corrosion resistance, color, electronic physical property, magnetic property, optical characteristics, etc.) vary depending on the surface treatment, surface structure and film structure of thin film, and the interface structure. JFE-TEC provides structure analysis techniques necessary for material design and failure analysis.

We investigate the crystalline morphology of surface treatment and thin film, coating state through section observation, composition and chemical state of lamination through observation, and the crystalline phase and orientation and then analyze the change of film after use, deterioration, and evaluation of functionalities.

  • Morphological observation

    • Observation of surface of plating crystal using ULV-SEM
    • Observation of coating deterioration of coated steel sheets using ULV-SEM
    • Observation of composite particle/filler using ULV-SEM, 3D observation of filler using FIB-SEM
    • Observation of oxide layer of surface of aluminum capacitor using LV-SEM
    • Observation of catalyst layer of surface of polymer substrate for electroless plating
    • Section observation of galvanized film using TEM
    • Observation of catalyst layer of surface of polymer substrate using Cs corrector STEM
    • Observation of ultra thin chemical treatment layer using TEM/ Cs corrector STEM
  • Elementary analysis

  • Chemical state analysis

    • Analysis in depth direction of Si oxide/metal Si on steel sheet using AES
    • Analysis of Cr morphology in tin plating for can
    • Analysis of chemical state of Cr in chromate layer using XPS
    • Oxidation state of color-changed Sn plating using XPS
    • Analysis of sp2/sp3 in DLC film using EELS
    • Analysis of electron state in non-crystalline WO3 thin film
  • Crystalline structure analysis

We analyze the multilayer interface of surface treatment film, thin film, alloy layer, reaction layer, and the diffusion layer of interface morphology of the base material.

  • Morphological observation

    • Observation of multilayer thin film lamination structure using ULV-SEM
    • Identification of interlayer exfoliation inter face using ULV-SEM
    • Observation of multilayer polymer film using ULV-SEM
    • Atomic-scale observation of lamination state of LED super lattice structure (MQW) using TEM
    • Observation of alloy phase of metallic plating/base material interface (FeZn/steel/Sn plating/Cu, etc.) using TEM
  • Element analysis

    • Identification of intermetallic compound in solder plating/Ni plating interface using SEM
    • Analysis of electrode surface sliding layer using Cs corrector STEM and TEM
    • Analysis of ceramic spray/substrate interface using Cs corrector STEM
    • Analysis of stainless steel passive film using Cs corrector STEM-EDX/EELS
    • Atomic-level mapping analysis of lamination condition of LED super lattice structure (MQW) using Cs corrector STEM- EELS/EDX
  • Chemical state analysis

    • interface of SiC-based power device MOSFET using Cs corrector STEM and TEM
  • Crystalline structure analysis

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